Nitride semiconductor laser element

ABSTRACT

A nitride semiconductor laser element includes a nitride semiconductor layer of a first conduction type, an active layer, and a nitride semiconductor layer of a second conduction type that is different from the first conduction type are laminated in that order, a cavity end face formed by the nitride semiconductor layers, and a protective film formed on the cavity end face. The nitride semiconductor layers of the first and second conduction types have layers containing Al, and the active layer has layer containing In. The protective film has a region in which an axial orientation of crystals is the same as that of the cavity end face on the nitride semiconductor layers of the first and second conduction types, and has another region in which an axial orientation of crystals is different from that of the cavity end face on the active layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. patent applicationSer. No. 12/166,746 filed on Jul. 2, 2008, now pending. This applicationclaims priority to Japanese Patent Application Nos. 2007-178915,2007-222613 and 2008-161731. The entire disclosures of U.S. patentapplication Ser. No. 12/166,746, and Japanese Patent Application Nos.2007-178915, 2007-222613 and 2008-161731 are hereby incorporated hereinby reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a nitride semiconductor laser element,and more particularly relates to a nitride semiconductor laser elementhaving a protective film of a specific structure on a cavity end face.

2. Background Information

With a nitride semiconductor laser element, end faces of the cavityformed by RIE (reactive ion etching) or cleavage has narrow bandgapenergy, so absorption of the exiting light occurs at the end face, thisabsorption generates heat at the end face, and problems such as a shortservice life are encountered in trying to obtain a high-output laser.Consequently, there has been proposed, for example, a method formanufacturing a high-output semiconductor laser in which a silicon oxideor nitride film is formed as a protective film on the cavity end face(see, for example, Japanese Laid-Open Patent Application H10-70338).This protective film functions as a window layer, and suppresses theabsorption of light at the cavity end face.

However, with a nitride semiconductor laser element, even if theprotective film is made from a material capable of suppressing theabsorption of light at the cavity end face, there will still be aproblem in that the desired function cannot be achieved because theprotective film separates or cracks develop in the laminated nitridesemiconductor layers due to a difference in the lattice constants of thenitride semiconductors.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is simplified cross section illustrating the structure of thelaser elements of the present invention;

FIGS. 2A to 2C are simplified diagrams illustrating the structure of thefirst protective film of the present invention;

FIG. 3 is simplified a schematic TEM (transmission electron microscope)image illustrating the cross sectional first protective film of thepresent invention;

FIGS. 4A to 4J are schematic electron beam diffraction imagesillustrating the state of axial orientation at the various points on thefirst protective film shown in FIG. 3;

FIG. 5 is a graph showing the relationship of the output-forward currentbefore and after high-output drive of the present invention;

FIG. 6 is a schematic TEM image illustrating the state of axialorientation of another cross sectional first protective film of thepresent invention;

FIG. 7 is a schematic TEM image illustrating the state of axialorientation of still another cross sectional first protective film ofthe present invention;

FIG. 8 is a schematic TEM image illustrating the state of axialorientation of still another cross sectional first protective film ofthe present invention;

FIG. 9 is a schematic image illustrating the state of axial orientationof still another cross sectional first protective film of the presentinvention.

SUMMARY

The present invention was conceived in light of this problem, and it isan object thereof to provide a nitride semiconductor laser element thathas good characteristics, with which the generation of cracks in thenitride semiconductor layer is suppressed, and no separation of theprotective film occurs at the end face.

One aspect of the present invention provides a nitride semiconductorlaser element including nitride semiconductor layers, a cavity end faceand a protective film. The nitride semiconductor layers has a nitridesemiconductor layer of a first conduction type, an active layer, and anitride semiconductor layer of a second conduction type that isdifferent from the first conduction type are laminated in that order.The cavity end face is formed by the nitride semiconductor layers. Theprotective film is formed on the cavity end face. The nitridesemiconductor layer of the first conduction type and the nitridesemiconductor layer of the second conduction type have a layercontaining Al, and the active layer has a layer containing In. Theprotective film has a region in which an axial orientation of crystalsis the same as that of the cavity end face on the nitride semiconductorlayer of the first conduction type and the nitride semiconductor layerof the second conduction type, and has another region in which an axialorientation of crystals is different from that of the cavity end face onthe active layer.

Further, another aspect of the present invention provides a nitridesemiconductor laser element including nitride semiconductor layers, acavity end face and a protective film. The nitride semiconductor layershas a nitride semiconductor layer of a first conduction type, an activelayer, and a nitride semiconductor layer of a second conduction typethat is different from the first conduction type are laminated in thatorder. The cavity end face is formed by the nitride semiconductorlayers. The protective film is formed on the cavity end face. Thenitride semiconductor layer of the first conduction type and the nitridesemiconductor layer of the second conduction type have a layercontaining Al, and the active layer has a layer containing In. Theprotective film has a region in which an axial orientation of crystalsis different from that of a contact interface of the nitridesemiconductor layers at the cavity end face with respect to thedirection of lamination of the protective film.

With the above aspects of present invention, a protective film formed ona cavity end face is disposed so as to have a region of differentcrystal axial orientation in the lamination direction of the nitridesemiconductor layers, the result being that even during high-outputdrive of the nitride semiconductor laser element, load on thesemiconductor layer due to stress of the protective film is reduced,that is, fewer cracks develop in the nitride semiconductor layer, and itis possible to prevent separation of the protective film, etc.Accordingly, a high COD (Catastrophic Optical Damage) level can bemaintained without any change occurring over time, and a nitridesemiconductor laser element with high performance, high output, and highreliability can be provided.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The inventors conducted diligent research into protective films forcavity end faces in order to obtain good characteristics, andparticularly a higher COD level, even under high-output drive, so that anitride semiconductor laser element with higher reliability could beobtained. As a result, they discovered that the orientation of theprotective film itself affects such things as separation of theprotective film and the load on the semiconductor layer due to stress ofthe protective film, and more particularly that there are changes overtime in high-output drive. In other words, although the COD level ishigh at the start of drive when the orientation of the protective filmis uniform, the COD level decreases over time due to such factors asseparation of the protective film and load on the semiconductor layer asthe drive output rises.

Also, they discovered that, when there is a great difference betweenlattice constant of the cavity end face which is an exposure face of thestacked nitride semiconductor layers and lattice constant of theprotective film formed on the cavity end face, the COD level decreasesbecause the protective film formed on the cavity end face is generated alight absorbing region composed of polycrystalline and the like therein.This is affected by the property of the protective film formed on alight waveguide region which is formed within the nitride semiconductorlayers, and particularly an active layer.

This revealed that adjusting the orientation/lattice constant of theprotective film allows the characteristics of a semiconductor laserelement to be maintained over an extended period, and this led to theperfection of the present invention.

As typically shown in FIGS. 1 and 2A, for example, a nitridesemiconductor laser element of the present invention mainly includes asemiconductor layers comprising a first nitride semiconductor layer 12,an active layer 13, and a second nitride semiconductor layer 14 in thisorder, and cavity end faces disposed on opposed end faces of thesemiconductor layers.

This nitride semiconductor laser element is usually formed on asubstrate 11, a ridge 16 is formed on the surface of the second nitridesemiconductor layer 14, and a first protective film 21 and a secondprotective film 22 are formed. Further, an embedded film 15, a p-sideelectrode 17, an n-side electrode 20 are formed. As shown in FIG. 1, anthird protective film 18, a p-side pad electrode, and so forth areformed.

As shown in FIGS. 2A, 2B, and 2C, the first protective film is a filmformed in contact with at least one cavity end face (and particularlythe end face where light exits, hereinafter sometimes referred to as a“front side”). In this specification, hereinafter, the protective filmwill also be referred to as a “first protective film” and the first andsecond protective films which are formed on the cavity end face will bereferred to as an “end face protective film.” This first protective filmhas a region in which the axial orientation of the crystals is differentin the direction of lamination of the nitride semiconductor layers. Thatis, the first protective film does not have a uniform crystal axialorientation in the in-plane, and the axial orientation instead varies.Combinations of such difference axial orientations in the in-planeencompasses various possibilities, such as a M axis (1-100) orientationregion and a C axis (0001) orientation region, or the M axis orientationregion and an A axis (11-20) orientation region, or the M axisorientation region and the R axis (1-102) orientation region, or the Caxis orientation region and the A axis orientation region, or the C axisorientation region and the R axis orientation region, or the A axisorientation region and the R axis orientation region, or the like.

Also, the first protective film may not have a uniform crystal axialorientation in the direction of the thickness, and the axial orientationinstead varies. Combinations of the such difference axial orientationsin the direction of the thickness, similar to the difference in theaxial orientation in-plane, encompasses various possibilities, such as achange from the M axis (1-100) to the C axis (0001), or a change fromthe M axis to the A axis (11-20), or a change from the M axis to the Raxis (1-102), or a change from the C axis to the A axis, or a changefrom the C axis to the R axis, or a change from the A axis to the Raxis, from the cavity end face side to a surface side or in the reversedirection thereof.

The phrase “axis orientation” here is not strictly limited to a state inwhich a single crystal is oriented along the M axis, C axis, A axis, orR axis, and may encompass a state in which polycrystalline are alsopresent, but a region (also, portion(s) or part(s)) oriented along the Maxis, C axis, A axis, or R axis are included uniformly, or a state inwhich these are uniformly dispersed. When there is thus apolycrystalline state, there will not be a clear difference in thelattice constant from that of the cavity end face, and this differencecan be lessened.

This change in the axial orientation need not be a change to acompletely different axial orientation, and may instead be a situationin which different axial orientations coexist, or in which theproportion of a different axial orientation becomes higher.

The axial orientation of the crystal in the first protective film ispreferably so as to have a region where the axial orientation of thecrystal is different from that of the cavity end face at the contactinterface with the cavity end face.

Because the crystal structure of the first protective film of thepresent invention is such that there is a region where the axialorientation is different within the in-plane and at least on the contactside with the nitride semiconductor layers, stress is divided at theinterface between regions of differing axial orientation, and stress isrelieved within the first protective film. Also, at the interfacebetween regions of differing axial orientation, there is a latticeconstant differential and a coefficient of thermal expansiondifferential. This, particularly having the lattice constantdifferential at the interface between regions of differing axialorientation, relieves stress in the first protective film and thus tothe nitride semiconductor layers, prevents the first protective filmfrom separating, and increases the COD level.

The axial orientation of the first protective film can be determined bythe composition of the nitride semiconductor layers of the cavity endface. For instance, as will be discussed below, when the nitridesemiconductor layer is formed from In_(x)Al_(y)Ga_(1−x−y)N(0≦x≦1,0≦y≦1), 0≦x+y≦1) on the basis of GaN, as the composition of xincreases, there is a tendency for the axial orientation of the firstprotective film to be different from that of the cavity end face. Also,as the composition of y increases, there is a tendency for the axialorientation of the first protective film to be same as that of thecavity end face.

More specifically, when the cavity end face is the M plane, that is,when the nitride semiconductor layers are oriented with C axisorientation in the direction of lamination of the nitride semiconductorlayers, as shown in FIG. 9, M axial orientation and C axial orientationare fairly well mixed in the region of the first protective film 61 incontact with the GaN layer that is part of the nitride semiconductorlayers constituting the cavity end face.

If indium proportion for only a tiny part of the InGaN layer, then theproperties of the GaN layer will be dominant in the first protectivefilm, and while M axial orientation and C axial orientation will befairly well mixed in the first protective film, as the proportion ofindium increases, the properties of the indium will gradually come outin the first protective film, and the indium properties will eventuallybecome dominant, so that a region appears in which substantially only Caxial orientation is present in the first protective film (See FIG. 9).The point at which the indium properties appear here can be suitablyadjusted by means of the film formation method or the film thickness,for instance, but an example of the indium proportion x is a range ofabout 0.01 to 0.30, and preferably about 0.01 to 0.20, and morepreferably about 0.02 to 0.07.

In the case of an AlGaN layer, as the proportion of aluminum increases,the properties of the aluminum gradually appear in the first protectivefilm, and eventually aluminum properties become dominant, so that aregion appears in which substantially only M axial orientation ispresent in the first protective film (see FIG. 9). The point at whichthe aluminum properties appear here can be suitably adjusted by means ofthe film formation method or the film thickness, for instance, but anexample of the aluminum proportion y is a range of about 0.0001 or more,and preferably about 0.001 or more, and still preferably about 0.01 ormore.

The term “dominant” as used here indicates both that the proportion ishigher and that the properties are more pronounced compared to those ofothers.

In FIG. 9, interfaces between a C axial orientation region and a M axialorientation region, the C axial orientation and a (M+C) axis orientationregion are indicated by dotted line, but the location of the dotted linecan be shifted depend on the indium or aluminum proportions in eachnitride semiconductor layer. This allows the first protective film incontact with the nitride semiconductor layer which does not directlycontribute to a light emission to adhere well to the nitridesemiconductor layer, whereas it is possible to suppress the absorptionof light at the first protective film in contact with the nitridesemiconductor layer which does directly contribute to a light emission.

In particular, when the nitride semiconductor layer has anIn_(x)Ga_(1−x)N (0<x≦1) layer, the In_(x)Ga_(1−x)N (0<x≦1) layer usuallyhas a crystal structure with C axial orientation in the laminationdirection of the nitride semiconductor layer, and the first protectivefilm has a crystal structure with C axial orientation in the directionperpendicular to the cavity end face.

However, the axis orientation of the laminated nitride semiconductorlayers not necessarily may be partially or all of the same as that ofthe first protective film at the contact interface between them.

From another standpoint, when the nitride semiconductor layer is formedfrom In_(x)Al_(y)Ga_(1−x−y)N (0≦x≦1, 0≦y ≦1, 0≦x+y≦1), on the basis ofGaN, a region in which substantially only C axial orientation is presentcan be obtained in the first protective film by setting the bandgapenergy of the nitride semiconductor layers to be the same or lower.Also, a region in which substantially only M axial orientation ispresent can be obtained in the first protective film by setting thebandgap energy of the nitride semiconductor layers to be higher.

From yet another standpoint, when the nitride semiconductor layer isformed from In_(x)Al_(y)Ga_(1−x−y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1), on thebasis of GaN, a region in which substantially only C axial orientationis present can be obtained in the first protective film by setting thelattice constant of the nitride semiconductor layer to be the same orlarger. Also, a region in which substantially only M axial orientationis present can be obtained in the first protective film by setting thelattice constant of the nitride semiconductor layer to be smaller, onthe basis of GaN.

That is, if the difference between the lattice constant of the welllayers that make up the active layer and the lattice constant of thefirst protective film is to be reduced, then the axial orientation ofthe first protective film may be different from the axial orientation ofthe well layer exposed at the cavity end face, in other words, these maynot be lattice-matched. If the difference between the lattice constantof the nitride semiconductor layer exposed as the cavity end face andthe lattice constant of the first protective film formed at the cavityend face is reduced, it is believed that optical absorption can besuppressed at the contact interface between these, and that the CODlevel can thus be increased.

Also, the first protective film may be lattice-matched to the nitridesemiconductor layer. However, there is no need for lattice matching overthe entire contact interface between the nitride semiconductor layer andthe first protective film.

This differences in axial orientation within the in-plane of the firstprotective film is, in one embodiment, believed to appear or vary due tothe axis orientation of the nitride semiconductor itself contact withthe first protective film or composition as well as a difference inbandgap, or in lattice constant, or in the thickness or in thecomposition of the nitride semiconductor layer of the adjacent the firstprotective film. Therefore, these variation and differences in axialorientation of the first protective film tend to occur at the laminationinterface of the nitride semiconductor layer and in the vicinitythereof.

For example, when the nitride semiconductor layer is an InGaN layer, andan AlGaN layer is disposed on one side thereof, the first protectivefilm in contact with the InGaN layer tends to be affected by theadjacent AlGaN layer, and it has been confirmed that as the aluminumcontent rises, the effect of the AlGaN layer increases.

Therefore, the change in axial orientation and the differences of theaxial orientation in the in-plane of the first protective film need notnecessarily occur at all the lamination interfaces of the nitridesemiconductor layers.

More specifically, the differences of the axial orientation in thein-plane of the first protective film tends to form at the interfacewith the active layer and the nitride semiconductor layer of the firstconduction type, and at the interface with the active layer and thenitride semiconductor layer of the second conduction type. Also, if theactive layer has a quantum well structure, this difference tends to format one or more interfaces with barrier layer and the well layer, and atthe interface with the outermost barrier layer and the well layer and inthe vicinity thereof easily. Stress can be relieved in the firstprotective film by having the axial orientation in the in-plane of thefirst protective film be different at the active layer or on the opticalwaveguide including the active layer, from that at the nitridesemiconductor layer laminated above and below the active layer, on thecavity end face formed by the nitride semiconductor layers.

Over the cavity end face formed in the nitride semiconductor layers, theaxial orientation in the in-plane of the first protective film ispreferably different from that of the cavity end face at the activelayer or on the optical waveguide including the active layer, andpreferably at the well layer and in the vicinity of the barrier layerlaminated above and below the well layer, and is preferably the same asthat of the cavity end face at the nitride semiconductor layer laminatedabove and below the active layer. Having the axial orientation be thesame as that of the cavity end face over the nitride semiconductor layerlaminated above and below results in good adhesion between the firstprotective film and the nitride semiconductor layer. Also, if the firstprotective film is formed with different axial orientation from that ofthe cavity end face at the active layer or on the optical waveguideincluding the active layer, then a region will be formed with differentaxial orientation in the in-plane direction of the first protectivefilm, which cause an interface between different axial orientationregions, so stress is relieved in the first protective film. As aresult, stress attributable to heat caused by irradiation with laserlight at the cavity end face, particularly near the active layer, can berelieved by difference of the axial orientation of the first protectivefilm, and this also effectively prevents separation of the firstprotective film, loading of the nitride semiconductor layer, etc.

When a plurality of well layers is used, the first protective film ispreferably formed in a different axial orientation from that of thecavity end face, continuously between the well layers at both ends.

In particular, when the active layer has a multiple quantum wellstructure comprising two or more well layers, it is preferable if thefirst protective film has the same axial orientation of the crystals,continuously in the lamination direction of the nitride semiconductorlayers over the active layer between the well layers located on bothsides (see FIG. 8).

The first protective film may have a region in which the crystal axialorientation is different from that of the cavity end face in thethickness direction of the first protective film from the contactinterface with the well layer (see FIGS. 3 and 6, etc.). This allowsstress to be relieved in the thickness direction of the first protectivefilm as well.

The first protective film may be a film composed of oxides (Si, Mg, Al,Hf, Nb, Zr, Sc, Ta, Ga, Zn, Y, B, Ti, etc.), nitrides (AlN, AlGaN, GaN,BN, SiN, etc.) or fluorides and the like. Among these, the firstprotective film preferably includes the crystal structure of hexagonalsystem, and composed of AlN.

The protective film may be formed, for example, about 5 to about 500 nm,and preferable about 5 to about 100 nm. Also, the protective film may beformed not only on the end face where light exits (front side) of thecavity, but also on the end face where light reflects (hereinaftersometimes referred to as a “rear side” which is the face on the oppositeside).

The state of the first protective film is generally classified asmonocrystalline, polycrystalline, or amorphous, depending on the degreeof crystallization of the material that makes up the film.Monocrystallines have almost no variation in lattice constant amongmaterials, and there is almost no lattice plane inclination. To put thisanother way, the atoms in the material are arranged in a regularpattern, and order is maintained over an extended distance.Polycrystallines are made up of numerous microscopic monocrystallines,i.e., microcrystallines. An amorphous material is one that has noperiodic structure such as that in a crystal, that is, it means that theatomic arrangement is irregular and there is no order over an extendeddistance.

The state of the film (crystalline or a crystal state in the case of acrystal substance) can be easily evaluated from a diffraction imageproduced by electron beam. How the elements that make up the crystalsare arranged can be grasped visually from the resulting electron beamdiffraction image.

That is, an electron beam is directed at the film, and an electron beamdiffraction image appears corresponding to the planar direction and thesize of the lattice constant. For instance, in the case of amonocrystalline, since the crystal planes are almost aligned, thediffraction points are observed to align with good regularity. In thecase of a polycrystalline, since it is made up of microcrystals, thelattice planes are not all facing the same way, and the diffractionpoints may come together in a complex fashion, or Debye rings may beseen. In the case of an amorphous material, meanwhile, since the atomicarrangement does not have a periodic structure over an extendeddistance, no electron beam diffraction occurs. Therefore, this isobserved as a state in which the diffraction image has no diffractionpoints.

That crystallinity is different, and that the axial orientation of thecrystal structure is different can be confirmed not only by TEM, STEM(Scanning Transmission Electron Microscope), SEM (Scanning ElectronMicroscope), and other kinds of cross section observation (bright field,selected-field, high resolution and the like), but also by electron beamdiffraction or the product of subjecting these patterns to FFT (FastFourrier Transform), or from the difference in the etching rate.

In other words, in observing a protective film under a microscope, adifference can be visually ascertained, which is due to a difference incrystallinity, between a region adjacent the active layer and a regionin contact with the first and second nitride semiconductor layers.

In particular, in observation by STEM, TEM or the like, a contrast(bright or dark) is observed due to the different states of the film(crystalline or a crystal state in the case of a crystal substance).

Also, even when the same film is observed, contrast will sometimes beobserved to be inverted when the observation conditions (STEM or TEMimage display settings) are changed.

An electron beam diffraction image can be observed by cutting theprotective film so that a cross section is exposed with respect to theend face where the protective film is formed, and directing an electronbeam at this cross section. The electron beam diffraction imageobservation can be carried out, for example, using a JEM-2010F made byJEOL.

Observation is conducted by the following procedure. First, a specimenis cut out by microprobing using a focused ion beam (FIB) machiningapparatus (for example, SMI3050MS2 made by Seiko Instruments Inc.), anda thin film (for example, at least about 100 nm) is obtained bysubjecting the specimen to FIB machining. Further thin film (forexample, at least about 50 nm) working is performed by ion milling.Then, a dark field image can be obtained by performing TEM observationat a prescribed acceleration voltage (for example, about 200 kV).

Furthermore, if the first protective film thus obtained is immersed in asuitable etchant, such as an acid solution (for example, bufferedhydrofluoric acid or the like) or alkali solution (for example, KOH orthe like), a difference in crystallinity can be discerned from adifference in solubility (etching rate difference). In this etching, amaterial with poor crystallinity will be quickly dissolved or removed,while a material with good crystallinity will remain or be preserved.

These are not the only methods that can be used, and the crystallinityof the first protective film can be evaluated using any known method.

The first protective film can be formed, for example, by a method thatis known in this field. For instance, this can be vapor deposition,sputtering, reactive sputtering, ECR (electron cyclotron resonance)plasma sputtering, magnetron sputtering, ion beam assist deposition, ionplating, laser ablation, CVD (Chemical Vapor Deposition), spraying, spincoating, dipping, a combination of these two or more methods, acombination of these methods and oxidation treatment (thermaltreatment), or any of various other methods, and preferably ECR plasmasputtering.

Although it will depend on the film formation method, it is preferableto control film formation by subjecting the end face of the cavity to anitrogen plasma treatment prior to film formation, or to adjust the filmformation rate to a relatively first rate, or to control the atmosphereduring film formation (to reduce a nitrogen gas partial pressure to theextent that the protective film does not have absorption, for example),or to adjust the film formation pressure to a relatively high level,etc. Two or more of these methods may also be combined. Also, thenitrogen partial pressure may be gradually or abruptly changed duringthe film formation in each method, or the film formation pressure may begradually or abruptly changed.

Examples include a method in which, in forming a film by sputteringusing the first protective film material as a target, the film formationrate is gradually or suddenly increased, or the RF power is gradually orsuddenly increased (with the range of increase being about 100 to 1000W), or the distance between the target and the substrate is gradually orsuddenly changed (with the range of change being about 0.2 to 3 timesthe original distance), and a method in which the pressure is graduallyor suddenly decreased (with the range of decrease being about 0.1 to 2.0Pa) in forming a film using the first protective film material as atarget.

For example, to obtain a film by using ECR plasma sputtering method, itis preferably to adjust a film at a film formation rate of 0.5 to 10nm/min. The microwave power is preferably 300 to 1000 W, the RF power is100 to 1000 W.

Also, a method in which the temperature of the substrate is gradually orsuddenly increased or lowered (with the range of change being about 50to 500° C.) may be used. Then, thermal treatment may be performed.

When an AlN film is formed by ECR sputtering, if the cavity end face isthe M plane, orientation of the film can be along the M axis (coaxial)and the C axis (stable). The film formation rate has to be controlled inorder to control the orientation of the film, and M axial orientation ismore easily continued if the film formation rate is lowered. Examples ofways to lower the film formation rate include lowering the RF power,lowering the film formation gas pressure, and raising the nitrogen gaspartial pressure. It is also possible to form AlN with partial M axialorientation and C axial orientation by raising the film formation rateby raising the RF power, lowering the film formation gas pressure,lowering the nitrogen gas partial pressure, etc. It is preferable for anAlN film to be formed such that, depending on these conditions, theaxial orientation of crystals in the lamination direction of the nitridesemiconductor layers is different in M axial orientation and C axialorientation in the first protective film formed on the cavity end face.This relieves stress to the nitride semiconductor, prevents the firstprotective film from separating, and allows the COD level to be kepthigh even after high-output drive.

Furthermore, these methods can be combined as desired.

Examples of preferable conditions for forming the first protective filminclude a film formation rate of about 2.5 to 10 nm/min, a microwavepower of 400 to 1000 W, and an RF power of about 400 to 1000 W. The useof argon, krypton, xenon, or another such rare gas is preferable for theatmosphere gas. When a film of AlN is to be formed, it is preferable touse an aluminum target and set the flow of nitrogen (nitrogen rawmaterial) to between about 3 and 8 sccm, and the flow of atmosphere gasto between about 25 and 50 sccm. Furthermore, differences in axialorientation and/or lattice constant in the in-plane and/or thicknessdirection of the first protective film can be achieved by combining andsuitably adjusting these parameters.

In the nitride semiconductor laser of the present invention, it ispreferably formed a second protective film 22 on the first protectivefilm 21 as the end face protective film, as shown in FIG. 2A. The secondprotective film can make the first protective film to be more forciblyadhered into the cavity end face.

The second protective film may be a film composed of oxides of Si, Mg,Al, Hf, Nb, Zr, Sc, Ta, Ga, Zn, Y, B, Ti, etc., preferably be a filmcomposed of SiO₂.

The second protective film may be has any of single layer or laminatedstructure. The second protective film is preferably an amorphous film.This divides the stress at the interface where the axial orientation ofthe crystals formed by the first protective film is different, allowsstress to be released better, and improves the adhesion of the firstprotective film.

The thickness of the second protective film is preferably greater thanthe thickness of the above-mentioned first protective film. For example,the combined thickness of the above-mentioned first protective film andthe second protective film may be 0.1 to 2 μm or less. The result isthat the above-mentioned effects are more pronounced.

As shown in FIGS. 2B and 2C, the first protective film and/or the secondprotective film may be made of different materials, have differentthicknesses, etc., on the exit side and the reflecting side. The secondprotective film on the exit side is preferably formed from a singlelayer of SiO₂. Examples of the second protective film on the reflectingside include a laminated structure of SiO₂ and ZrO₂, and a laminatedstructure of Al₂O₃ and ZrO₂. The lamination period and so forth can beadjusted as needed, according to the desired reflectivity.

The amorphous second protective film is similar to the above-mentionedfirst protective film in that it can be formed by any of the knownmethods listed above, etc. In particular, to create an amorphous film,although it will depend on the film formation method, it is preferablyto control film formation by adjusting the film formation rate to befaster, or controlling the atmosphere during film formation to be anoxygen atmosphere, or adjusting the film formation pressure higher, orthe like, or by combining two or more of these methods. When an oxygenatmosphere is used, the oxygen is preferably introduced to the extentthat absorption is not induced. Specific film formation conditions arepreferably such that the film is formed using a silicon target in an ECRplasma sputtering device, at an oxygen flow of 3 to 20 sccm, a microwavepower of 300 to 1000 W, and an RF power of about 300 to 1000 W.

In the present invention, a substrate for forming the nitridesemiconductor laser may be an insulating substrate or a conductivesubstrate. The substrate is, for example, preferably a nitridesemiconductor substrate having an off angle of no more than 10° andgreater than 0° to the first main face and/or the second main face. Thethickness of the substrate is at least 50 μm and no more than 10 mm, forexample. A commercially available substrate, any of the various knownsubstrates disclosed, for instance, in Japanese Laid-Open PatentApplication 2006-24703, or the like may be used.

The nitride semiconductor substrate can be formed by a vapor phasegrowth method such as MOCVD (Metal Organic Chemical Vapor Deposition),HVPE (Hydride Vapor Phase Epitaxy), MBE (Molecular Beam Epitaxy), or thelike, a hydrothermal synthesis method in which crystals are grown in asupercritical fluid, a high pressure method, a flux method, a meltmethod, or the like.

The nitride semiconductor layer may include a layer having a generalformula of In_(x)Al_(y)Ga_(1−x−y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1). In additionto this, it may be used the semiconductor layer which is partlysubstituted with B as a group III element, or is substituted a part of Nas a group V element with P or As.

The n-side nitride semiconductor layer may doped with at least onen-type impurity of IV or VI group elements, such as Si, Ge, Sn, S, O,Ti, Zr, Cd etc. The p-side nitride semiconductor layer may doped with atleast one p-type impurity, such as Mg, Zn, Be, Mn, Ca, Sr etc. The dopedconcentration is, for example, about 5×10¹⁶/cm³ to about 1×10²¹/cm³. Asfor the first conductivity and the second conductivity, which may ben-type or p-type. All of layers in the n-type or p-type nitridesemiconductor layers may not necessarily contain n-type or p-typeimpurity.

The nitride semiconductor layers of the first and second conductivitytype can be formed as a layer having a function of clad, guide, cap,contact, clack preventing, or the like with a single layer, multilayer,or super lattice structure in position in conjunction with anappropriate structure or composition in order to obtain a semiconductorlaser element having a desired characteristics.

Also, at least one of the nitride semiconductor layers of the first andsecond conductivity type that make up the structure may exhibit n-typeor p-type conductivity, all of the layers need to exhibit n-type orp-type conductivity.

The active layer may be a multiple quantum well or single quantum wellstructure. The active layer preferably comprises a layer which includesindium, and it is suitable that the composition is an average mixedcrystal with an indium component of more than 0.5 and 15% or less, andpreferably from 0.5 to 10%, and more preferably 0.5 to 7%.

The nitride semiconductor layer preferably has a structure which is aSCH (Separate Confinement Heterostructure) wherein an optical waveguideis constituted by providing n-side and p-side optical guide layers aboveand below the active layer. However, there is no particular restrictionon these structures.

In the nitride semiconductor laser element of the present invention mayemits laser light with a wavelength of about 370 to 500 nm, it ispossible to prevent separation of the end face protective films and toimprove COD level.

There is no particular restriction on a growth method of the nitridesemiconductor layer, it can be formed by means of any known method whichcan grow these nitride semiconductor layers, such as MOVPE (MetalOrganic Vapor Phase Epitaxy), MOCVD, HVPE, MBE or the like. Inparticular, MOCVD is preferable because it allows the nitridesemiconductor to be growth with good crystallinity.

A ridge is formed on the surface of the second conductivity type nitridesemiconductor layer. The ridge functions as an optical waveguide, thewidth of the ridge may be from about 1.0 to 30.0 μm, about 1.0 to 8.0μm, and preferably about 1.0 to 3.0 μn. The height of the ridge (theetching depth) may be, for example, may be from about 0.1 to 2 μm. Theextent of optical confinement can be suitably adjusted by adjusting thethickness, material, and so on of the layer that makes up the secondconductivity type semiconductor layer. The ridge is preferably set so asto be about 200 to 5000 μm of cavity length. The ridge need not be allthe same width in the extension direction of the cavity, and its sidefaces may be vertical or may be tapered with an angle of about 45 to90°.

The cavity end face formed by the nitride semiconductor layers may beeither the M plane (1-100), A plane (11-20), C plane (0001), or R plane(1-102), but the M plane is preferred. This is because the face can beformed easily and precisely by cleavage.

An embedded film is usually formed on the surface of the nitridesemiconductor layer and to the side faces of the ridge. That is, theembedded film is above the nitride semiconductor layer, and is formed ina region other than the region where an electrical connection betweenthe nitride semiconductor layer and an electrode (discussed below) ismade. There are no particular restrictions on the position, size, shape,etc., of the region of connection between the nitride semiconductorlayer and the electrode, but this region may, for example, be part ofthe surface of the nitride semiconductor layer, such as substantiallythe entire top face of the stripe-like ridge formed on the surface ofthe nitride semiconductor layer.

The embedded film is generally formed from an insulating material with asmaller refractive index than that of the nitride semiconductor layer.The refractive index can be measured using a polarizing ellipsometer(featuring ellipsometry), more specifically, it is, for example, HS-190made by J. A. WOOLLAM and other ellipsometers. This embedded film is aninsulator of a dielectric film of single layer or multilayer filmcomposed of oxides, nitrides or oxide-nitrides of Zr, Si, V, Nb, Hf, Ta,Al, Ce, In, Sb, Zn and the like. The embedded film may havemonocrystalline, polycrystalline or amorphous structure. If the embeddedfilm is formed from the side faces of the ridge all the way to thesurface of the nitride semiconductor on both sides of the ridge, it willensure a refractive index difference versus the nitride semiconductorlayer, and particularly the second conductivity type semiconductorlayer, which allows leakage of light from the active layer to becontrolled, allows light to be confined efficiently within the ridge,and also better ensures insulation near the base of the ridge, so thegeneration of leak current can be avoided.)

This embedded film can be formed by any method that is known in thisfield. For instance, a variety of methods can be used, such as vapordeposition, sputtering, reactive sputtering, ECR plasma sputtering,magnetron sputtering, ion beam assist deposition, ion plating, laserablation, CVD, spraying, spin coating, dipping, a combination of thesetwo or more methods, a combination of these methods and oxidationtreatment (thermal treatment), or the like.

Electrodes of the nitride semiconductor laser element of the presentinvention are a pair of the electrode which is electrically connectedwith the first and second conductivity type nitride semiconductorlayers, respectively.

The p-side and an n-side electrodes may preferably be formed with asingle layer or laminated layer of a metal or metal alloy of palladium,platinum, nickel, gold, titanium, tungsten, cupper, silver, zinc, tin,indium, aluminum, iridium, rhodium, ITO (Indium Tin Oxide) or the like.The electrodes are suitable formed in a thickness of for example, about50 to about 500 nm.

The electrode connected with the second conductivity type nitridesemiconductor layer is preferably formed over the nitride semiconductorlayer and the embedded film.

The electrode connected with the first conductivity type nitridesemiconductor layer may be formed either directly on the firstconductivity type nitride semiconductor layer, i.e., formed on the sameside with a p-side electrode with respect to the substrate, or on thesubstrate.

A third protective film is preferably formed on the embedded film. Thisthird protective film may be disposed over the embedded film on at leastthe surface of the nitride semiconductor layer, and preferably alsocovers the side faces of the nitride semiconductor layer and/or the sidefaces, surface, etc., of the substrate with or without the embedded filminterposed therebetween. The third protective film can be formed fromthe same materials as those listed as examples for the embedded film. Asa result, it is possible to ensure not only insulation reliably but alsoprotection for the exposed side faces, surface, etc., of nitridesemiconductor layer.

A conductive layer such as a pad electrode of single layer or laminatedlayer may be formed on the embedded film, electrode and the thirdprotective film over the side faces of the nitride semiconductor layersup to the top face.

Examples of the nitride semiconductor laser element of the presentinvention will now be described in detail through reference to thedrawings. The present invention is not, however, limited to or by theseexamples.

EXAMPLE 1

As shown in FIGS. 1 and 2C, the nitride semiconductor laser element ofthis Example comprises the first nitride semiconductor layer 12, theactive layer 13, and the second nitride semiconductor layer 14 on thesurface of which is formed the ridge 16, laminated in that order on thesubstrate 11, and a cavity is formed therein. With this nitridesemiconductor laser element, a first protective film 21 and a secondprotective film 22 are formed on a light exit side of a cavity end face,and a first protective film 21 a and a second protective film 22 a areformed on a light reflecting side of the cavity are formed, and also anembedded film 15, a p-side electrode 17, an n-side electrode 20, a thirdprotective film 18, a pad electrode 19 and the like are formed.

The cavity end faces are formed by a nitride semiconductor layers havingM axial orientation, and the first protective film is composed of AlN inwhich the axial orientation is different in the in-plane, i.e., theaxial orientation changes in the in-plane, and has a thickness of about30 nm.

This laser element can be manufactured by the following method (See,FIG. 3).

First, a GaN substrate (not shown) is provided. In a reaction vessel, ann-side clad layer 12 b composed of Al_(0.03)Ga_(0.97)N doped with Si at4×10¹⁸/cm³ (2 μm thick) is grown on the GaN substrate at a growthtemperature of 1160° C. using trimethylaluminum (TMA), trimethylgallium(TMG) and ammonia (NH₃) as the raw material gas with a silane gas for animpurity gas. This n-side clad layer 12 b may be composed of a superlattice structure.

Next, the silane gas and TMA is stopped, and n-side wave guide layer 12a composed of undoped GaN (0.175 μm thick) is grown at a growthtemperature of 1000° C. This wave guide layer 12 a may be doped withn-type impurities.

The temperature is set to 900° C., trimethylindium (TMI) is used, abarrier layer 13 b composed of In_(0.02)Ga_(0.98)N doped with Si (14 nmthick) and at same temperature, a well layer 13 a composed of undopedIn_(0.07)Ga_(0.93)N (8 nm thick) are laminated on the barrier layer 13b. This process is repeated 2 times, finally an undoped barrier layer 13b is formed on the layers to grow an active layer 13 composed of amultiple quantum well structure (MQW)) with a total thickness of 58 nm.

TMI is stopped, a p-side cap layer 14 a composed of p-Al_(0.2)Ga_(0.8)Ndoped with Mg at 1×10²⁰/cm³ (10 nm thick) is grown on the active layer13 using TMG, TMA, NH₃, and Cp₂Mg (bis-cyclopentadienyl magnesium) at agrowth temperature of 1000° C. This p-side cap layer 14 a can beomitted.

Next, Cp₂Mg gas and TMA are stopped, and p-side wave guide layer 14 bcomposed of undoped GaN (0.145 μm thick) is grown at a growthtemperature of 1000° C.

The temperature is set to 1000° C., and an A layer composed of undopedAl_(0.10)Ga_(0.90)N (2.5 nm thick) is grown, and then TMA is stopped andCp₂Mg gas is used, a B layer composed of GaN (2.5 nm thick) islaminated. The A layer and the B layer are alternately laminated, andthis process is repeated to grow a p-side clad layer 14 c composed of asuper lattice structure with a total thickness of 0.4 μm.

Finally, a p-side contact layer (not shown) composed of GaN doped withMg at 1×10²⁰/cm³ (15 nm thick) is grown on the p-side clad layer 14 c ata growth temperature of 1000° C.

The resulting wafer on which the nitride semiconductor has been grown istaken out of the reaction vessel, and a mask composed of SiO₂ is formedon the surface of the p-side contact layer (the outermost layer). Andthe nitride semiconductor layers are etched using the mask to form astripe-shaped structure of the nitride semiconductor with a length,which corresponds to cavity length, of 800 μm. This portion will be mainbody of the cavity in the laser element. The cavity length may bepreferably set to the range from 200 to 5000 μm.

Next, a stripe-shaped mask composed of SiO₂ is formed on the surface ofthe p-side contact layer, and the nitride semiconductor layer(s) areetched by RIE (Reactive Ion Etching) method using SiCl₄ gas and thestripe-shaped mask. By this means, a stripe-shaped ridge 16 waveguideregion is formed with a width of 1.5 μm.

Then, the sides of the ridge are protected by an embedded film 15composed of ZrO₂.

Next, a p-side electrode 17 composed of Ni (10 nm)/Au (100 nm)/Pt (100nm) is formed on the surface overlying the p-side contact layer and theembedded film. After that, ohmic annealing is performed at 600° C.Subsequently, a third protective film composed of silicon oxide (SiO₂:0.5 μm thick) is formed by sputtering on the embedded film, and on thesides of the semiconductor layer.

Ni (8 nm)/Pd (200 nm)/Au (800 nm) are formed continuously in this orderon the exposed p-side electrode that is not covered by the thirdprotective film, to produce a p-side pad electrode 19.

And then, the surface of the substrate which is opposite to the sidegrowing the nitride semiconductor layers is polished so as to have athickness of 80 μm.

An n-side electrode 20 composed of V (10 nm)/Pt (200 nm)/Au (300 nm) isformed on the polished surface of the substrate.

Next, recessed grooves are formed on the side, on which the n-sideelectrode 20 is formed, of the substrate in a wafer state having then-side electrode, the p-side electrode and the p-side pad electrode.These grooves is set to depth of 10 μm, the length of 50 μm in thedirection parallel to the end faces of the cavity, from the side surfaceof the nitride semiconductor layer and the width of 15 μm in thedirection perpendicular to the end faces. The cleaving is performedusing the recessed grooves from the recessed grooves to produce bars inwhich the cleavage faces, (1-100) plane, are the cavity end faces.

On the light exit side of the cavity end faces of the obtained element,a first protective film 21 is formed, and then a second protective film22 is formed on the first protective film.

That is, the first protective film 21 (30 nm) which is composed of AlNis formed at a microwave power of 800 W, RF power of 800 W, and at afilm formation rate of 3 nm/min, a an Ar flow of 30 sccm, and a N₂ flowof 10 sccm with an ECR plasma sputtering apparatus using an Al target.

Next, on the first protective film formed on the light exit face of thecavity, an SiO₂ film is formed as the second protective film 22 in athickness of 250 nm with a sputtering apparatus using an Si target, at amicrowave power of 500 W, RF power of 500 W, and an oxygen flow of 5sccm.

On the light reflecting side of the cavity, an Al₂O₃ film is formed as aprotective film 23 in a thickness of 62 nm, SiO₂/ZrO₂ films are formedas a protective film 24 in a thickness of 67 nm/44 nm with six cyclerepetition thereon.

After that, the bar is chipped in the direction perpendicular to the endfaces of the cavity to be formed into a chip for a semiconductor laserelement.

To check the configuration of the first protective film of the resultingnitride semiconductor laser element, a cross section of the nitridesemiconductor laser element was observed under a field emission type ofscanning electron microscope (JEM-2010F), and the bright field TEM imagewas measured. This can be measured by directing an electron beam at thefirst protective film from the GaN (11-20) plane direction at a cameralength of 50 cm.

FIGS. 4A to 4J show the state of axial orientation at the various pointson the protective film 21 shown in FIG. 3, as diffraction patterns ofthe electron beam.

It can be seen from the diffraction patterns of the electron beam inFIGS. 4 a to 4 j that the first protective film in which the axialorientation is different in the in-plane can be formed on the cavity endface, depending on the nitride semiconductor layer composition, as shownin FIG. 3.

It was also found that as the thickness of the AlN film increases, thereis a change to C axial orientation in the region where M axialorientation and C axial orientation are both present. This change to Caxial orientation was found to appear at about 5 to 20 nm, depending onthe nitride semiconductor layer composition.

Thus, how the elements that make up the crystals of the first protectivefilm are arranged can be visually ascertained from the resultingelectron beam diffraction image.

Furthermore, when a film near a cavity end face is observed, diffractionpoints of the GaN constituting the nitride semiconductor layer maysometimes be observed. In this case, the GaN diffraction points can beseparated out before analysis.

The optical output of the resulting semiconductor laser element beforeand after continuous high-output oscillation was measured at a Tc of 80°C., a Po of 320 mW, and an oscillation wavelength of 405 nm. The resultsare shown in FIG. 5.

In FIG. 5, the data indicated by the thin line show the current-opticaloutput characteristics before high-output oscillation of the laserelement of the present invention, and the data indicated by the thickline show the current-optical output characteristics after continuoushigh-output oscillation of a laser element.

According to FIG. 5, it can be seen that the COD level is kept high,with almost no change, both before and after continuous high-outputoscillation.

Thus, with the nitride semiconductor laser element of this Example, nostress is produced in the nitride semiconductor that makes up the cavityend face, the generation of cracks in the nitride semiconductor can beprevented, and the end face protective film adheres well to the cavityend face and does not separate. This means that a nitride semiconductorlaser element with high performance and output and an increased CODlevel can be obtained.

EXAMPLE 2

A semiconductor laser element is formed by substantially the same methodand constitution as in Example 1, except that, as shown in FIG. 2B, theprotective film of the cavity end face in Example 1 is changed on therear side to a first protective film 21 a composed of AlN (32 nm) and asecond protective film 22 a composed of SiO₂ (250 nm), SiO₂/ZrO₂ filmsare formed in a thickness of 67 nm/44 nm with six cycle repetitionthereon.

This semiconductor laser element has the same crystallinity of the firstprotective films as in Example 1, and the COD level is similarlyincreased.

EXAMPLE 3

A semiconductor laser element was formed by substantially the samemethod and constitution as in Example 1, except that the protective filmof the cavity end face in Example 1 was changed on the front side to aprotective film composed of AlN (20 nm).

As shown in FIG. 6, a region in which the crystal axial orientation wasdifferent, within the first protective film 31, was identified in thelamination direction of the nitride semiconductor layer. The resultingelectron beam diffraction images at the various points in FIG. 6 aresubstantially the same as those shown in FIG. 4.

EXAMPLE 4

A semiconductor laser element was formed by substantially the samemethod and constitution as in Example 1, except that the protective filmof the cavity end face in Example 1 was changed on the front side to aprotective film composed of AlN (10 nm).

As shown in FIG. 7, a region in which the crystal axial orientation wasdifferent, within the first protective film 41, was identified in thelamination direction of the nitride semiconductor layer. The resultingelectron beam diffraction images at the various points in FIG. 7 aresubstantially the same as those shown in FIG. 4.

EXAMPLE 5

In Example 5, a nitride semiconductor laser element is produced insubstantially the same manner as in Example 1, except that when thefirst protective film 21 composed of AlN was formed on the cavity endface, the conditions were changed so that the Ar flow is 50 sccm, the N₂flow is 10 sccm, the microwave power is 500 W, the RF power is 500 W,and the film formation rate is 3 nm/min.

The structure and characteristics of the first protective film of thenitride semiconductor laser element thus obtained are substantially thesame as those in Example 1.

EXAMPLE 6

In Example 6, a nitride semiconductor laser element is produced insubstantially the same manner as in Example 1, except that when thefirst protective film 21 composed of AlN was formed on the cavity endface, the conditions were changed so that the Ar flow is 30 sccm, the N₂flow is 6 sccm, the microwave power is 500 W, the RF power is 500 W, andthe film formation rate is 3 nm/min.

The structure and characteristics of the first protective film of thenitride semiconductor laser element thus obtained are substantially thesame as those in Example 1.

EXAMPLE 7

In Example 7, a nitride semiconductor laser element is produced insubstantially the same manner as in Example 1, except that when thefirst protective film 21 composed of AlN was formed on the cavity endface, the conditions were changed so that firstly the Ar flow is 30sccm, the N₂ flow is 10 sccm, the microwave power is 800 W, the RF poweris 800 W, and the film formation rate is 3 nm/min, and then, the Ar flowis 30 sccm, the N₂ flow is 10 sccm, the microwave power is 500 W, the RFpower is 500 W, and the film formation rate is 2 nm/min.

The structure and characteristics of the first protective film of thenitride semiconductor laser element thus obtained are substantially thesame as those in Example 1.

EXAMPLE 8

In Example 8, a nitride semiconductor laser element is produced insubstantially the same manner as in Example 1, except that when thefirst protective film 21 composed of AlN was formed on the cavity endface, the conditions were changed so that firstly the Ar flow is 50sccm, the N₂ flow is 10 sccm, the microwave power is 500 W, the RF poweris 500 W, and the film formation rate is 3 nm/min, and then, the Ar flowis 30 sccm, the N₂ flow is 10 sccm, the microwave power is 500 W, the RFpower is 500 W, and the film formation rate is 2 nm/min.

The structure and characteristics of the first protective film of thenitride semiconductor laser element thus obtained are substantially thesame as those in Example 1.

EXAMPLE 9

In Example 9, a nitride semiconductor laser element is produced insubstantially the same manner as in Example 1, except that when thefirst protective film 21 composed of AlN was formed on the cavity endface, the conditions were changed so that firstly the Ar flow is 30sccm, the N₂ flow is 6 sccm, the microwave power is 500 W, the RF poweris 500 W, and the film formation rate is 3 nm/min, and then, the Ar flowis 30 sccm, the N₂ flow is 10 sccm, the microwave power is 500 W, the RFpower is 500 W, and the film formation rate is 2 nm/min.

The structure and characteristics of the first protective film of thenitride semiconductor laser element thus obtained are substantially thesame as those in Example 1.

EXAMPLE 10

In Example 10, a nitride semiconductor laser element is produced insubstantially the same manner as in Example 1, except that when thefirst protective film 21 composed of AlN was formed on the cavity endface, the conditions were changed so that firstly the Ar flow is 30sccm, the N₂ flow is 10 sccm, the microwave power is 500 W, the RF poweris 500 W, and the film formation rate is 2 nm/min, and then, the waferkeep a distance of 20 mm from the target, the Ar flow is 30 sccm, the N₂flow is 10 sccm, the microwave power is 500 W, the RF power is 500 W,and the film formation rate is 1.7 nm/min.

The structure and characteristics of the first protective film of thenitride semiconductor laser element thus obtained are substantially thesame as those in Example 1.

EXAMPLE 11

In Example 11, a semiconductor laser element was formed by substantiallythe same method and constitution as in Example 1, except that the firstprotective film 21 of the cavity end face in Example 1 was changed to athickness of 10 nm.

The axial orientation of the first protective film of the resultingnitride semiconductor laser element changed hardly at all in thethickness direction of the protective film, regardless of which nitridesemiconductor layer it was over, and the same changes as in Example 1were noted, only in the in-plane direction of the first protective film.

EXAMPLE 12

A semiconductor laser element is formed by substantially the same methodand constitution as in Example 1, except the followings; the protectivefilm of the cavity end face on the front side in Example 1 is changed toa first protective film 21 composed of AlN (30 nm), the first protectivefilm is formed under the conditions that the Ar flow is 50 sccm, the N₂flow is 5 sccm, the microwave power is 800 W, the RF power is 800 W, andthe film formation rate is 7 nm/min.

The nitride semiconductor laser element obtained in Example 12 wasobserved with a field emission type of transmission electron microscopein the same manner as in Example 1. FIG. 8 is a schematic view of this.

It can be seen in FIG. 8 that the axial orientation in the in-plane isdifferent with respect to the cavity end face depending on thecomposition of the nitride semiconductor layer, and that the firstprotective film whose crystal orientation is different from that of thecavity plane of the nitride semiconductor layer can be formed over themajority of the nitride semiconductor layer including the InGaN layer.

Also, it was found that as the thickness of the first protective film(AlN) increases, there is a change to C axial orientation in the regionwhere M axial orientation and C axial orientation are both present. Thischange to C axial orientation was seen to appear at about 5 to 20 nmdepending on the composition of the nitride semiconductor layer.

The nitride laser element thus obtained was measured for optical outputin the same manner as in Example 1, whereupon substantially the sameresults were obtained as in Example 1.

Thus, with the nitride semiconductor laser element of this Example 12,it is possible to obtain the end face protective film with which thereis no stress produced in the nitride semiconductor that makes up thecavity end face, cracking in the nitride semiconductor is prevented,adhesion with the cavity end face is good, and separation is prevented.It was confirmed that this allows a nitride semiconductor laser elementto be obtained with an increased COD level, higher performance, andhigher output.

EXAMPLE 13

A semiconductor laser element is formed by substantially the same methodand constitution as in Example 1, except the followings; the activelayer is formed of a multi quantum well structure (MQW)) with a totalthickness of 72 nm through that a barrier layer 13 b composed ofIn_(0.02)Ga_(0.98)N doped with Si (14 nm thick), a well layer 13 acomposed of undoped In_(0.07)Ga_(0.93)N (8 nm thick) are laminated onthe barrier layer 13 b and this process is repeated 2 times, finally thebarrier layer 13 b composed of undoped In_(0.02)Ga_(0.98)N (28 nm thick)is formed on the layers, and the protective film of the cavity end faceon the front side in Example 1 is changed to a first protective film 21composed of AlN (30 nm), the first protective film is formed under theconditions that the Ar flow is 50 sccm, the N₂ flow is 5 sccm, themicrowave power is 800 W, the RF power is 800 W, and the film formationrate is 7 nm/min.

The structure and characteristics of the first protective film of thenitride semiconductor laser element thus obtained are substantially thesame as those in Example 1.

EXAMPLE 14

A semiconductor laser element of this Example 14 can be manufactured bythe following method according to the method of Example 1.

First, an n-layer composed of Al_(0.02)Ga_(0.98)N doped with Si at4×10¹⁸/cm³ (1 μm thick) is grown on the GaN substrate at a growthtemperature of 1100° C. using TMA, TMG and ammonia as the raw materialgas with a silane gas for an impurity gas. Nest, In_(0.05)Ga_(0.95)Ndoped with Si (0.15 μm thick) is grown at a growth temperature of 930°C., and an n-side clad layer composed of Al_(0.06)Ga_(0.94)N doped withSi at 4×10¹⁸/cm³ (2 μm thick) is grown. This n-side clad layer may becomposed of a super lattice structure.

Next, an n-side wave guide layer composed of undoped GaN (0.3 μm thick)is grown at a growth temperature of 1000° C. This wave guide layer 12 amay be doped partially or wholly with n-type impurities.

The temperature is set to 900° C., a first barrier layer composed ofIn_(0.02)Ga_(0.98)N doped with Si (70 nm thick), an undoped GaN (1 nmthick) on the first barrier layer, and at the temperature to 850° C., awell layer composed of undoped In_(0.13)Ga_(0.87)N (3 nm thick) arelaminated. The temperature is set to 900° C., undoped GaN (14 nm thick),and at the temperature to 850° C., a well layer composed of undopedIn_(0.13)Ga_(0.87)GaN (3 nm thick) are laminated. Finally the barrierlayer composed of undoped In_(0.02)Ga_(0.98)N (70 nm thick) islaminated.

A p-side cap layer is formed the same method as in Example 1.

Next, Cp₂Mg gas and TMA are stopped, and p-side wave guide layercomposed of undoped GaN (0.3 μm thick) is grown at a growth temperatureof 1000° C. This p-side wave guide layer may be doped partially orwholly with p-type impurities.

A p-side clad layer and a p-side contact layer (15 nm thick) are formedthe same method as in Example 1.

The resulting wafer on which the nitride semiconductor has been grown istaken out of the reaction vessel, a stripe-shaped structure of thenitride semiconductor which will be main body of the cavity in the laserelement is formed the same method as in Example 1.

Next, a stripe-shaped mask composed of SiO₂ is formed on the surface ofthe p-side contact layer, and the nitride semiconductor layer(s) areetched by RIE method using SiCl₄ gas and the stripe-shaped mask. By thismeans, a stripe-shaped ridge waveguide region is formed with a width of2.0 μm.

Then, the sides of the ridge are protected by an embedded film 15composed of ZrO₂ (200 nm thick).

Next, a p-side electrode 17 and a third protective film is formed thesame method as in Example 1. After that, ohmic annealing is performed.

A p-side pad electrode is formed and the surface of the substrate ispolished the same method as in Example 1.

On the light exit side of the cavity end faces, a first protective film21 is formed, and then a second protective film 22 is formed on thefirst protective film.

That is, the first protective film 21 (10 nm) which is composed of AlNis formed at a microwave power of 800 W, RF power of 800 W, and at afilm formation rate of 3 nm/min, an Ar flow of 30 sccm, and a N₂ flow of10 sccm with an ECR plasma sputtering apparatus.

Next, on the first protective film formed on the light exit face of thecavity, a SiO₂ film is formed as the second protective film 22 in athickness of 295 nm with a sputtering apparatus using an Si target, at amicrowave power of 500 W, RF power of 500 W, and an oxygen flow of 5sccm.

On the light reflecting side of the cavity, an ZrO₂ film is formed in athickness of 49 nm, and SiO₂/ZrO₂ films are formed in a thickness of 75nm/49 nm with six cycle repetition thereon.

After that, the bar is chipped in the direction perpendicular to the endfaces of the cavity to be formed into a chip for a semiconductor laserelement.

The structure and characteristics of the first protective film of thenitride semiconductor laser element thus obtained are substantially thesame as those in Example 1.

EXAMPLE 15

A semiconductor laser element of this Example is formed by substantiallythe same method and constitution as in Example 1, except that, end faceprotective film in Example 1 is changed to a film composed of AlN (32nm), SiO₂ (260 nm) and ZrO₂ (45 nm) in this order from the end face sideof the cavity.

The structure and characteristics of the first protective film of thenitride semiconductor laser element thus obtained are substantially thesame as those in Example 1.

The present invention can be applied to a wide range of nitridesemiconductor elements with which the protective film needs to adherewell to the semiconductor layer, such as in use as light emittingelements (e.g., LD, LED, super luminescence diode, etc.), solar cells,light-receptive elements (e.g., light sensor, etc.), electric devices(e.g., transistor, power device, etc.) and the like. In particular, itis useful as nitride semiconductor elements in optical diskapplications, optical communications systems, printers, optical exposureapplications, and various devices for measurement, excitation lightsource for bio-specific applications and the like.

While only selected embodiments have been chosen to illustrate thepresent invention, it will be apparent to those skilled in the art fromthis disclosure that various changes and modifications can be madeherein without departing from the scope of the invention as defined inthe appended claims. Furthermore, the foregoing descriptions of theembodiments according to the present invention are provided forillustration only, and not for the purpose of limiting the invention asdefined by the appended claims and their equivalents. Thus, the scope ofthe invention is not limited to the disclosed embodiments.

1. A nitride semiconductor laser element comprising: nitridesemiconductor layers in which a nitride semiconductor layer of a firstconduction type, an active layer, and a nitride semiconductor layer of asecond conduction type that is different from the first conduction typeare laminated in that order; a cavity end face formed by the nitridesemiconductor layers; and a protective film formed on the cavity endface, the nitride semiconductor layer of the first conduction type andthe nitride semiconductor layer of the second conduction type having alayer containing Al, and the active layer having a layer containing In,the protective film having a region in which an axial orientation ofcrystals is the same as that of the cavity end face on the nitridesemiconductor layer of the first conduction type and the nitridesemiconductor layer of the second conduction type, and having anotherregion in which an axial orientation of crystals is different from thatof the cavity end face on the active layer.
 2. The element according toclaim 1, wherein the protective film has a region in which an axialorientation of crystals is different from that of a contact interface ofthe nitride semiconductor layers at the cavity end face with respect tothe direction of lamination of the protective film.
 3. The elementaccording to claim 1, wherein the protective film has a region in whichan axial orientation of crystals varies in the direction of laminationof the protective film.
 4. The element according to claim 1, wherein theprotective film has a hexagonal system crystal structure.
 5. The elementaccording to claim 1, wherein the protective film has a regionlattice-matched to the nitride semiconductor layer.
 6. The elementaccording to claim 1, wherein the active layer is a multiple quantumwell structure comprising two or more well layers, and the protectivefilm is arranged such that the same axial orientation of the crystals iscontinuous in the lamination direction of the nitride semiconductorlayer over the active layer between the two well layers.
 7. The elementaccording to claim 1, further comprising an additional protective filmformed on the protective film, the additional protective film being anamorphous film.
 8. The element according to claim 1, wherein the activelayer is composed of InGaN, and the indium proportion is in a range of0.01 to 0.30.
 9. The element according to claim 1, wherein at least oneof the nitride semiconductor layer of the first conduction type and thenitride semiconductor layer of the second conduction type is composed ofAlGaN.
 10. The element according to claim 1, wherein the protective filmis composed of AlN.
 11. A nitride semiconductor laser elementcomprising: nitride semiconductor layers in which a nitridesemiconductor layer of a first conduction type, an active layer, and anitride semiconductor layer of a second conduction type that isdifferent from the first conduction type are laminated in that order; acavity end face formed by the nitride semiconductor layers; and aprotective film formed on the cavity end face, the nitride semiconductorlayer of the first conduction type and the nitride semiconductor layerof the second conduction type having a layer containing Al, and theactive layer having a layer containing In, the protective film having aregion in which an axial orientation of crystals is different from thatof a contact interface of the nitride semiconductor layers at the cavityend face with respect to the direction of lamination of the protectivefilm.
 12. The element according to claim 11, wherein the protective filmhas a region in which an axial orientation of crystals varies in thedirection of lamination of the nitride semiconductor layers.
 13. Theelement according to claim 11, wherein the protective film has a regionin which an axial orientation of crystals varies in the direction oflamination of the protective film.
 14. The element according to claim11, wherein the protective film has a hexagonal system crystalstructure.
 15. The element according to claim 11, wherein the protectivefilm has a region lattice-matched to the nitride semiconductor layer.16. The element according to claim 11, wherein the active layer is amultiple quantum well structure comprising two or more well layers, andthe protective film is arranged such that the same axial orientation ofthe crystals is continuous in the lamination direction of the nitridesemiconductor layer over the active layer between the two well layers.17. The element according to claim 11, further comprising an additionalprotective film formed on the protective film, the additional protectivefilm being an amorphous film.
 18. The element according to claim 11,wherein the active layer is composed of InGaN, and the indium proportionis in a range of 0.01 to 0.30.
 19. The element according to claim 11,wherein at least one of the nitride semiconductor layer of the firstconduction type and the nitride semiconductor layer of the secondconduction type is composed of AlGaN.
 20. The element according to claim11, wherein the protective film is composed of AlN.